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3DPrint.com News: August 4, 2026

News, Analysis and Resources
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Polish Electronics 3D Printing OEM XTPL Sells 10 More Printhead Modules to First Chinese Customer

By Matt Kremenetsky on Aug 04, 2026 09:00 am

Smartphones, laptops, and all other such devices are only getting more expensive. As evidenced by Apple’s cautioning of higher prices for this year’s new iPhone line, the problem is largely the result of surging AI...

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Binder Jetting’s Next Test: High-Temperature Superalloys, with AmPd Labs and Continuum

By Vanesa Listek on Aug 04, 2026 08:30 am

Can binder jetting deliver the performance of investment casting while reducing cost, lead times, and manufacturing complexity? That’s the focus of The Future of High-Temperature Superalloys, an upcoming webinar presented by Continuum Powders in partnership...

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Electroninks’ EMI Shielding Materials Give it an Expanded Presence in Japan

By Matt Kremenetsky on Aug 04, 2026 08:00 am

In the current global economic context, which is being shaped primarily by national leaders trying out new forms of geopolitical leverage on a daily basis, advanced manufacturing partnerships between American and Japanese companies would seem...

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EOS Joins the MAT‑H2 Consortium

By Joris Peels on Aug 04, 2026 03:00 am

EOS is joining the MAT‑H2 consortium. MAT is an EU-funded group that aims to do research into a hydrogen-led economy. The thinking is that hydrogen will be a clean energy source for industrial processes and...

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